About this Research Topic
Recently, the development of advanced PCB and FPCB has made it possible to manufacture various device applications. For a long time, conventional Rigid-type PCB has been widely used a lot in electronics, however mobile devices, wearable devices, implantable devices, wireless communication, and portable devices required high-resolution circuit implementation capabilities and transformable substrates in various forms.
Materials such as Liquid Crystal Polymer(LCP), Glass, Polyimide(PI), and Ajinomoto Build-up Film(ABF) are attracting attention as next-generation substrate materials, and component manufacturing, and multi-layer lamination, component mounting technology are recognized as important points to improve performance. Additionally, the components mounted on the substrate include batteries, capacitors, resistors, and ICs, and a number of studies are being actively conducted with the aim of reducing the mounting area as much as possible.
Frontiers in Mechanical Engineering offers a special collection for Advanced PCB / FPCB components manufacturing technology and the goal of this collection is to create a platform for researchers to present their findings in different areas of sensing technology. The topics covered by this special issue includes but not limited to PCB design, modeling and simulation, material and fabrication process development, and proof of concept of PCB based components.
We accept manuscripts in the following areas of PCB based technology:
1) PCB based components and devices.
2) Advanced and Flexible PCB based components and devices.
3) Multi-layer PCB lamination process
4) Embedding components in the substrate
5) 5G/6G mobile antenna module application based PCB/FPCB
6) High-resolution patterning process
Materials such as Liquid Crystal Polymer(LCP), Glass, Polyimide(PI), and Ajinomoto Build-up Film(ABF) are attracting attention as next-generation substrate materials, and component manufacturing, and multi-layer lamination, component mounting technology are recognized as important points to improve performance. Additionally, the components mounted on the substrate include batteries, capacitors, resistors, and ICs, and a number of studies are being actively conducted with the aim of reducing the mounting area as much as possible.
Frontiers in Mechanical Engineering offers a special collection for Advanced PCB / FPCB components manufacturing technology and the goal of this collection is to create a platform for researchers to present their findings in different areas of sensing technology. The topics covered by this special issue includes but not limited to PCB design, modeling and simulation, material and fabrication process development, and proof of concept of PCB based components.
We accept manuscripts in the following areas of PCB based technology:
1) PCB based components and devices.
2) Advanced and Flexible PCB based components and devices.
3) Multi-layer PCB lamination process
4) Embedding components in the substrate
5) 5G/6G mobile antenna module application based PCB/FPCB
6) High-resolution patterning process
Keywords: PCB, FPCB, Lamination process, Multi-layer lamination process, High-resolution Line/Space patterning process, components in PCB.
Important Note: All contributions to this Research Topic must be within the scope of the section and journal to which they are submitted, as defined in their mission statements. Frontiers reserves the right to guide an out-of-scope manuscript to a more suitable section or journal at any stage of peer review.
