About this Research Topic
With the fast development of high-performance computing chips, the power density of the chips reaches to be higher than 30 w/cm^2. Therefore, the heat accumulation within the printed circuit board (PCB) shall sharply deteriorate the service life of the chips. Meanwhile, the COVID-19 depositories the global chips manufacturing lines, resulting in a shortage of chip products. Thus, developing high thermal conductivity lightweight alloy (Aluminum, Magnesium, etc.) heat sinks and other thermal management components is one of the critical research topics for chips and other electronics. Similarly, light-weighting efforts due to increased resource efficiency and material recycling requirements are crucial for a sustainable and circular society. One critical element in a circular society is the effects of trace elements and more complex material mixes, leading to new challenges for properties such as thermal conductivity.
Higher thermal conductivity and low thermal expansion are the two critical properties for designing high-quality heat sinks and other thermal management components. In addition, the mechanical properties determine the endurance of the thermal management components. Therefore, balancing the thermal and mechanical properties of lightweight alloys is essential, which is even more challenging with the increase in recycled materials. The regulatory methods include but are not limited to micro-alloying, heat treatment, surface treatment, etc.
This Special Issue aims to collect original works dealing with the novel light alloys fabrication, processing, and performance optimization technologies for both virgin and recycled materials. Papers that propose experimental and simulation methods are all welcome.
Higher thermal conductivity and low thermal expansion are the two critical properties for designing high-quality heat sinks and other thermal management components. In addition, the mechanical properties determine the endurance of the thermal management components. Therefore, balancing the thermal and mechanical properties of lightweight alloys is essential, which is even more challenging with the increase in recycled materials. The regulatory methods include but are not limited to micro-alloying, heat treatment, surface treatment, etc.
This Special Issue aims to collect original works dealing with the novel light alloys fabrication, processing, and performance optimization technologies for both virgin and recycled materials. Papers that propose experimental and simulation methods are all welcome.
Keywords: Light Weight Alloys, Thermal Conductivity, Thermal Expansion, Thermal Management, Manufacturing Technology, Additive Manufacturing, Mechanical Properties
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