About this Research Topic
In the swiftly progressing landscape of the electronics industry, the investigation of advanced electronic packaging materials stands as an essential frontier for technological breakthroughs. This field is committed to substantially enhancing the performance, functionality, and durability of packaging materials, while precisely predicting and controlling their behavior through cutting-edge constitutive models, multi-physics simulations, innovative design methodologies, and thorough reliability assessments. These endeavors offer deep insights into the utilization of groundbreaking materials and approaches, underscoring their vital role in shaping the future technological infrastructure.
The aim of this research is not only to revolutionize the electronics industry by developing materials that excel under extreme conditions and diverse operational environments but also to push the boundaries of traditional packaging with materials such as sintered nanoparticles, lead-free solders, composite materials, underfill materials, and third-generation semiconductor materials. This initiative seeks to engineer state-of-the-art electronic packaging solutions that are robust, lightweight, and capable of high thermal and electrical performance, which are pivotal for devices exposed to intense stress or extreme temperatures. By overcoming current limitations in electronic packaging design and functionality, and incorporating advanced structures such as high-density bonding wires, Through-Silicon Vias (TSVs), large-scale adhesion layers, micro-bumps, Wafer-Level Chip-Scale Packaging (WLCSP), and Fan-Out Wafer-Level Packaging (FOWLP), this field of study is on the brink of ushering in a new era of electronics. These technologies are set to integrate more seamlessly into a vast array of applications, dramatically enhancing performance and fostering new technological capabilities with improved reliability and efficiency.
For researchers and scientists dedicated to the field of advanced electronic packaging materials, this Research Topic provides an ideal platform to share their latest developments and insights. Advances in materials science, creative design strategies, and the integration of these innovations into next-generation electronics have the potential to transform pivotal sectors, including three-dimensional packaging, heterogeneous integrations, Micro-Electro-Mechanical Systems (MEMS), Wide Bandgap (WBG) Semiconductors, telecommunications, power electronics, automotive technology, and space exploration.
The topics covered under this research scope include, but are not limited to:
1) Advanced characterization and development of electronic packaging materials
2) Novel constitutive models of electronic packaging materials
3) Manufacturing and process optimization for advanced electronic packaging
4) Thermal management in advanced electronic packaging
5) Multi-physics simulations for advanced electronic packaging
6) Structural design in advanced electronic packaging
7) Reliability testing and failure analysis in advanced electronic packaging
8) Reliability assessment for advanced electronic packaging
The aim of this research is not only to revolutionize the electronics industry by developing materials that excel under extreme conditions and diverse operational environments but also to push the boundaries of traditional packaging with materials such as sintered nanoparticles, lead-free solders, composite materials, underfill materials, and third-generation semiconductor materials. This initiative seeks to engineer state-of-the-art electronic packaging solutions that are robust, lightweight, and capable of high thermal and electrical performance, which are pivotal for devices exposed to intense stress or extreme temperatures. By overcoming current limitations in electronic packaging design and functionality, and incorporating advanced structures such as high-density bonding wires, Through-Silicon Vias (TSVs), large-scale adhesion layers, micro-bumps, Wafer-Level Chip-Scale Packaging (WLCSP), and Fan-Out Wafer-Level Packaging (FOWLP), this field of study is on the brink of ushering in a new era of electronics. These technologies are set to integrate more seamlessly into a vast array of applications, dramatically enhancing performance and fostering new technological capabilities with improved reliability and efficiency.
For researchers and scientists dedicated to the field of advanced electronic packaging materials, this Research Topic provides an ideal platform to share their latest developments and insights. Advances in materials science, creative design strategies, and the integration of these innovations into next-generation electronics have the potential to transform pivotal sectors, including three-dimensional packaging, heterogeneous integrations, Micro-Electro-Mechanical Systems (MEMS), Wide Bandgap (WBG) Semiconductors, telecommunications, power electronics, automotive technology, and space exploration.
The topics covered under this research scope include, but are not limited to:
1) Advanced characterization and development of electronic packaging materials
2) Novel constitutive models of electronic packaging materials
3) Manufacturing and process optimization for advanced electronic packaging
4) Thermal management in advanced electronic packaging
5) Multi-physics simulations for advanced electronic packaging
6) Structural design in advanced electronic packaging
7) Reliability testing and failure analysis in advanced electronic packaging
8) Reliability assessment for advanced electronic packaging
Keywords: advanced electronics packaging, constitutive model, multi-physics simulation, design optimizations, reliability assessment
Important Note: All contributions to this Research Topic must be within the scope of the section and journal to which they are submitted, as defined in their mission statements. Frontiers reserves the right to guide an out-of-scope manuscript to a more suitable section or journal at any stage of peer review.
