REVIEW
Published on 24 Dec 2024
Review on multi-scale mechanics fundamentals and numerical methods for electronics packaging interconnect materials
doi 10.3389/fmats.2024.1532859
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- Frontiers in Materials
- Polymeric and Composite Materials
- Research Topics
- Advanced Electronic Packaging Materials: Constitutive Model, Simulation, Design and Reliability
Advanced Electronic Packaging Materials: Constitutive Model, Simulation, Design and Reliability
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Frontiers in Materials
- Polymeric and Composite Materials
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