ORIGINAL RESEARCH
Published on 26 Mar 2025
Microstructure, interfacial reaction and shearing property of Sn-58Bi solder joints reinforced by Zn particles during isothermal aging
doi 10.3389/fmats.2025.1581900
- 156 views
- Frontiers in Materials
- Polymeric and Composite Materials
- Research Topics
- Advanced Electronic Packaging Materials: Constitutive Model, Simulation, Design and Reliability
Advanced Electronic Packaging Materials: Constitutive Model, Simulation, Design and Reliability
1,272
Total downloads
7,023
Total views and downloads
Submit your idea
You will be redirected to our submission process.
Articles
MINI REVIEW
Accepted on 19 Mar 2025
Research Progress in Interface Optimization and Preparation Technology of High Thermal Conductivity Diamond/Copper Composite Materials
doi 10.3389/fmats.2025.1582990
REVIEW
Published on 03 Feb 2025
Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies
doi 10.3389/felec.2024.1515860
- 2,571 views
REVIEW
Published on 24 Dec 2024
Review on multi-scale mechanics fundamentals and numerical methods for electronics packaging interconnect materials
doi 10.3389/fmats.2024.1532859
- 571 views
ORIGINAL RESEARCH
Published on 02 Sep 2024
Lifetime prediction of copper pillar bumps based on fatigue crack propagation
doi 10.3389/fmats.2024.1470365
- 1,124 views
Manuscripts can be submitted to this Research Topic via the main journal or any other participating journal.
Submit your idea
You will be redirected to our submission process.