ORIGINAL RESEARCH
Accepted on 13 Mar 2025
Microstructure, interfacial reaction and shearing property of Sn-58Bi solder joints reinforced by Zn particles during isothermal aging
doi 10.3389/fmats.2025.1581900
- Frontiers in Materials
- Polymeric and Composite Materials
- Research Topics
- Advanced Electronic Packaging Materials: Constitutive Model, Simulation, Design and Reliability
Advanced Electronic Packaging Materials: Constitutive Model, Simulation, Design and Reliability
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Articles
REVIEW
Published on 03 Feb 2025
Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies
doi 10.3389/felec.2024.1515860
- 1,979 views
REVIEW
Published on 24 Dec 2024
Review on multi-scale mechanics fundamentals and numerical methods for electronics packaging interconnect materials
doi 10.3389/fmats.2024.1532859
- 506 views
ORIGINAL RESEARCH
Published on 02 Sep 2024
Lifetime prediction of copper pillar bumps based on fatigue crack propagation
doi 10.3389/fmats.2024.1470365
- 1,056 views
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