About this Research Topic
The field of electronic packaging is experiencing rapid advancements driven by the trends of miniaturization, high current density, and operation within extreme service environments. These trends, while fostering technological progress, introduce significant challenges that demand enhanced reliability in electronic packaging connections. The enforcement of the lead-free rule under the Restriction of Hazardous Substances Directive (RoHS) has spurred extensive research into various solder joints, including Sn-based, Ag-based, Bi-based, and In-based alternatives. Despite these efforts, issues such as diffusion between multi-phases and the growth kinetics of intermetallic compounds remain inadequately understood. Additionally, the evolution of packaging forms like Flip Chip (FC), System-on-Chip (SoC), and Through-silicon via (TSV) / Through-glass via (TGV) three-dimensional stacking has increased complexity, necessitating superior processing capabilities and reliable coatings and fillers. Furthermore, service environment-related challenges such as thermomechanical fatigue, electromigration, and thermal migration require more effective solutions.
This Research Topic aims to collect contributions that explore the reliability and related concerns of solder joints in electronic products. The primary objectives include addressing specific questions about the materials and processes that can enhance the reliability of electronic packaging. Hypotheses to be tested may involve the effectiveness of new interconnect and interface materials, the impact of different environmental conditions on solder joint performance, and the development of advanced physical simulation models to predict solder joint behavior under various stresses.
To gather further insights into the reliability of solder joints in electronic packaging, we welcome articles addressing, but not limited to, the following themes:
- Interconnect materials
- Interface materials
- Reliability of solder joints
- Physical simulation of solder joints
- Advanced packaging forms (e.g., Flip Chip, SoC, TSV/TGV)
- Thermomechanical fatigue
- Electromigration and thermal migration
- Coatings and fillers for enhanced reliability
Topic Editor Hongwen He is the CTO of Payton Technology Co., Ltd. and declares no competing interests with regards to the Research Topic Subject.
This Research Topic aims to collect contributions that explore the reliability and related concerns of solder joints in electronic products. The primary objectives include addressing specific questions about the materials and processes that can enhance the reliability of electronic packaging. Hypotheses to be tested may involve the effectiveness of new interconnect and interface materials, the impact of different environmental conditions on solder joint performance, and the development of advanced physical simulation models to predict solder joint behavior under various stresses.
To gather further insights into the reliability of solder joints in electronic packaging, we welcome articles addressing, but not limited to, the following themes:
- Interconnect materials
- Interface materials
- Reliability of solder joints
- Physical simulation of solder joints
- Advanced packaging forms (e.g., Flip Chip, SoC, TSV/TGV)
- Thermomechanical fatigue
- Electromigration and thermal migration
- Coatings and fillers for enhanced reliability
Topic Editor Hongwen He is the CTO of Payton Technology Co., Ltd. and declares no competing interests with regards to the Research Topic Subject.
Keywords: soldering, coating, diffusion, growth kinetics, temperature cycling, electromigration, shear strength, interface
Important Note: All contributions to this Research Topic must be within the scope of the section and journal to which they are submitted, as defined in their mission statements. Frontiers reserves the right to guide an out-of-scope manuscript to a more suitable section or journal at any stage of peer review.
