ORIGINAL RESEARCH
Published on 04 Sep 2024
Size dependence on shear fatigue and fracture behavior of ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints under current stressing
doi 10.3389/fmats.2024.1452773
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- Frontiers in Materials
- Mechanics of Materials
- Research Topics
- Advanced Materials and Reliability in Electronic Packaging
Advanced Materials and Reliability in Electronic Packaging
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