About this Research Topic
The momentum of change within the microelectronics sector is growing, as trends lean towards miniaturization, high current density, and operation within extreme service environments. These emerging trends, while progressing technological advancement, also pose new challenges—demanding a higher degree of connection reliability in electronic packaging. Under the requirements of the lead-free rule (Restriction of Hazardous Substances Directive, RoHS) for electronic products, this century has witnessed a surge in comprehensive research on various solder joints, encompassing Sn-based, Ag-based, Bi-based, In-based alternatives.
However, the diffusion issues between multi-phases and the growth kinetics of intermetallic compounds require further investigation. Advancements in various packaging forms, including Flip Chip (FC), System-on Chip (SoC), and Through-silicon via (TSV) / Through-glass via (TGV) three-dimensional stacking, also increase the complexity—requiring superior processing capabilities and reliability of coatings and fillers. In addition, service environment-related issues such as thermomechanical fatigue, electromigration, and thermal migration necessitate more reasonable solutions.
This Research Topic aims to collect contributions exploring the reliability and related concerns of solder joints in electronic products. The topics covered encompass, but are not limited to:
1. Interconnect materials;
2. Interface materials;
3. Reliability of solder joints;
4. Physical simulation of solder joints.
Topic Editor Hongwen He is the CTO of Payton Technology Co., Ltd. and declares no competing interests with regards to the Research Topic Subject.
However, the diffusion issues between multi-phases and the growth kinetics of intermetallic compounds require further investigation. Advancements in various packaging forms, including Flip Chip (FC), System-on Chip (SoC), and Through-silicon via (TSV) / Through-glass via (TGV) three-dimensional stacking, also increase the complexity—requiring superior processing capabilities and reliability of coatings and fillers. In addition, service environment-related issues such as thermomechanical fatigue, electromigration, and thermal migration necessitate more reasonable solutions.
This Research Topic aims to collect contributions exploring the reliability and related concerns of solder joints in electronic products. The topics covered encompass, but are not limited to:
1. Interconnect materials;
2. Interface materials;
3. Reliability of solder joints;
4. Physical simulation of solder joints.
Topic Editor Hongwen He is the CTO of Payton Technology Co., Ltd. and declares no competing interests with regards to the Research Topic Subject.
Keywords: soldering, coating, diffusion, growth kinetics, temperature cycling, electromigration, shear strength, interface
Important Note: All contributions to this Research Topic must be within the scope of the section and journal to which they are submitted, as defined in their mission statements. Frontiers reserves the right to guide an out-of-scope manuscript to a more suitable section or journal at any stage of peer review.
