About this Research Topic
The past decades have witnessed the rapid growth of photonic integration circuits (PIC) technology. Driven by cutting-edge development in material growth, processing, and design capability, the mainstream technologies (InP, SOI, and SiN) have reached a level at which they are now proposed as a generic platform by multiple foundries across the world.
The silicon and III-V photonic platforms have matured promptly from basic device proof-of-concepts to systems-level integration. Indium phosphide has the asset of merging all active functionalities (light generation, modulation, and detection). Despite requiring an external light source, silicon can offer remarkable passive components, efficient modulators, and detectors in an economical and more scalable platform. The integration provides size and cost reduction, stability and reliability, faster processing speed, larger information capacity, higher energy efficiency, and more versatility. As a key enabling technology, the field ensures to have a considerable impact on existing and new emerging applications, such as medical diagnostics, water quality, and pollution monitoring, bio-chemical sensing, data communication, optical metrology and sensing, and quantum information processing. For future applications, the integration approaches for combining different materials are triggered not only by cost-effectiveness but also by performance and required functionality.
Undertaking the technological obstacles for heterogeneous integration will authorize expanded functionality with large integration densities and higher volumes, which in turn can endorse integrated photonics to benefit new application domains.
This Research Topic ambitions to highlight the most appealing breakthroughs in the leading edge of PICs with a special emphasis on the heterogeneous integration of functional materials for applications beyond the traditional telecommunications wavelength range (UV, visible, and mid-IR spectral ranges). This encompasses new material platforms, new fabrication and characterization technologies, new device physics and architectures, and new design principles for miniaturized components and devices. We will consider theoretical, numerical, and experimental contributed papers that cover but are not limited to these topics:
- Heterogeneous integration of various material platforms for active functions
- Nonlinear integrated photonics and applications
- Reconfigurable integrated photonic
- Integrated photonics beyond telecom wavelengths
- Novel micro- and nanophotonic structures
- Novel materials, manufacturing, and packaging approaches for photonic integrated circuits.
The silicon and III-V photonic platforms have matured promptly from basic device proof-of-concepts to systems-level integration. Indium phosphide has the asset of merging all active functionalities (light generation, modulation, and detection). Despite requiring an external light source, silicon can offer remarkable passive components, efficient modulators, and detectors in an economical and more scalable platform. The integration provides size and cost reduction, stability and reliability, faster processing speed, larger information capacity, higher energy efficiency, and more versatility. As a key enabling technology, the field ensures to have a considerable impact on existing and new emerging applications, such as medical diagnostics, water quality, and pollution monitoring, bio-chemical sensing, data communication, optical metrology and sensing, and quantum information processing. For future applications, the integration approaches for combining different materials are triggered not only by cost-effectiveness but also by performance and required functionality.
Undertaking the technological obstacles for heterogeneous integration will authorize expanded functionality with large integration densities and higher volumes, which in turn can endorse integrated photonics to benefit new application domains.
This Research Topic ambitions to highlight the most appealing breakthroughs in the leading edge of PICs with a special emphasis on the heterogeneous integration of functional materials for applications beyond the traditional telecommunications wavelength range (UV, visible, and mid-IR spectral ranges). This encompasses new material platforms, new fabrication and characterization technologies, new device physics and architectures, and new design principles for miniaturized components and devices. We will consider theoretical, numerical, and experimental contributed papers that cover but are not limited to these topics:
- Heterogeneous integration of various material platforms for active functions
- Nonlinear integrated photonics and applications
- Reconfigurable integrated photonic
- Integrated photonics beyond telecom wavelengths
- Novel micro- and nanophotonic structures
- Novel materials, manufacturing, and packaging approaches for photonic integrated circuits.
Keywords: photonics, integrated circuits, integrated photonics, silicon
Important Note: All contributions to this Research Topic must be within the scope of the section and journal to which they are submitted, as defined in their mission statements. Frontiers reserves the right to guide an out-of-scope manuscript to a more suitable section or journal at any stage of peer review.
