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ORIGINAL RESEARCH article

Adv. Opt. Technol.
Sec. Optical Manufacturing and Design
Volume 13 - 2024 | doi: 10.3389/aot.2024.1513056
This article is part of the Research Topic Advanced Fabrication Techniques for High-Precision Optical Components View all articles

Influence of ultrasonic tool oscillation during drilling of fused silica

Provisionally accepted
Sebastian Henkel Sebastian Henkel 1*Marcel Binder Marcel Binder 1Monique Knauf Monique Knauf 1Jens Bliedtner Jens Bliedtner 1Edda Rädlein Edda Rädlein 2
  • 1 Ernst-Abbe-Hochschule Jena, Jena, Germany
  • 2 Technische Universität Ilmenau, Ilmenau, Thuringia, Germany

The final, formatted version of the article will be published soon.

    The creation of holes in hard-brittle materials is highly relevant for various applications. The oftennecessary high aspect ratios of the drill holes pose a particular challenge, with drill diameters of a few millimeters and drill lengths of up to several hundred millimeters. This requires the application of suitable tools with a high aspect ratio and sufficient stability. In particular the drilling process itself must be thoroughly understood and optimized in order to produce deep holes without component and tool defects while maintaining the required dimensional and positional accuracy. This paper presents investigations on the influence of an ultrasonic tool oscillation for drilling high aspect ratio holes. Two kinematic approaches, deep drilling and helical drilling, are examined with focus on the achievable dimensional accuracy of the holes and the roughness of the inner walls of the bore. It is found, that adding a longitudinal high frequency tool oscillation enables a considerable reduction in dimensional deviations of 91% for helical drilling.

    Keywords: Ultrasonic assisted grinding, drilling, Glass, fused silica, Diamond tools

    Received: 17 Oct 2024; Accepted: 02 Dec 2024.

    Copyright: © 2024 Henkel, Binder, Knauf, Bliedtner and Rädlein. This is an open-access article distributed under the terms of the Creative Commons Attribution License (CC BY). The use, distribution or reproduction in other forums is permitted, provided the original author(s) or licensor are credited and that the original publication in this journal is cited, in accordance with accepted academic practice. No use, distribution or reproduction is permitted which does not comply with these terms.

    * Correspondence: Sebastian Henkel, Ernst-Abbe-Hochschule Jena, Jena, Germany

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