The upgrading and development of power facilities and 5G devices has led to the continuous increase of power consumption and heat density of equipment. Resultantly, the generated overheating issues seriously reduce the efficiency and reliability of thermal-related electronic devices. In this respect, thermal management materials, including thermal conduction materials, thermal insulation materials, and thermal storage materials, are putting forward higher requirements for heat dissipation rate, thermal conductivity, heat storage efficiency and capacity. However, conventional thermal management materials have now reached a bottleneck, prompting the need for major technological breakthroughs in order to find emerging advanced thermal management materials. Considering these difficulties, it is urgent to further develop cutting-edge thermal management materials and technologies and to understand the complex thermal management mechanisms.
The purpose of this Research Topic is to further exchange and demonstrate advanced thermal conduction, thermal insulation, thermal storage materials and technologies. At present, most thermal management systems require faster/slower heat diffusion rate and thermal conductivity, and higher heat storage efficiency and capacity, so it is urgent to develop advanced functional materials with higher thermal management ability. Attractively, the integration of thermal conduction materials, thermal insulation materials, and thermal storage materials provides new possibilities to address these challenges. We hope to bring about major technological breakthroughs in the development of thermal management materials and technologies, pioneering advanced thermal management materials and concepts.
This Research Topic is intended to explore the innovative development of advanced thermal conduction, thermal insulation, thermal storage materials and technologies in batteries/electronic components, 5G telecom infrastructure, data centers, electrical devices, microelectronic packaging, etc. All original research papers, reviews and mini-reviews including, but not limited to the following topics are welcome:
1. Advanced thermal management concepts
2. Advanced thermal management technologies
3. Thermal management mechanisms
4. Advanced thermal storage materials
5. Advanced thermal conduction materials
6. Advanced thermal insulation materials
7. Advanced thermal interface materials
The upgrading and development of power facilities and 5G devices has led to the continuous increase of power consumption and heat density of equipment. Resultantly, the generated overheating issues seriously reduce the efficiency and reliability of thermal-related electronic devices. In this respect, thermal management materials, including thermal conduction materials, thermal insulation materials, and thermal storage materials, are putting forward higher requirements for heat dissipation rate, thermal conductivity, heat storage efficiency and capacity. However, conventional thermal management materials have now reached a bottleneck, prompting the need for major technological breakthroughs in order to find emerging advanced thermal management materials. Considering these difficulties, it is urgent to further develop cutting-edge thermal management materials and technologies and to understand the complex thermal management mechanisms.
The purpose of this Research Topic is to further exchange and demonstrate advanced thermal conduction, thermal insulation, thermal storage materials and technologies. At present, most thermal management systems require faster/slower heat diffusion rate and thermal conductivity, and higher heat storage efficiency and capacity, so it is urgent to develop advanced functional materials with higher thermal management ability. Attractively, the integration of thermal conduction materials, thermal insulation materials, and thermal storage materials provides new possibilities to address these challenges. We hope to bring about major technological breakthroughs in the development of thermal management materials and technologies, pioneering advanced thermal management materials and concepts.
This Research Topic is intended to explore the innovative development of advanced thermal conduction, thermal insulation, thermal storage materials and technologies in batteries/electronic components, 5G telecom infrastructure, data centers, electrical devices, microelectronic packaging, etc. All original research papers, reviews and mini-reviews including, but not limited to the following topics are welcome:
1. Advanced thermal management concepts
2. Advanced thermal management technologies
3. Thermal management mechanisms
4. Advanced thermal storage materials
5. Advanced thermal conduction materials
6. Advanced thermal insulation materials
7. Advanced thermal interface materials
