Heat transfer enhancement techniques are ideally employed to improve the thermal performance of the engineering systems. This is achieved either by reducing the thermal resistance or by increasing the effective heat transfer surface area. The majority of the heat transfer enhancement techniques are divided into active and passive cooling methods. Passive cooling methods like natural convection air cooling, thermoelectric cooling, heat pipes, and phase change-based cooling do not need any external energy for heat removal from the components. However, active cooling offers high cooling capacity and requires external energy in terms of a fan or blower for heat removal. Forced convection air cooling, liquid cooling, spray cooling, jet impingement cooling, refrigeration cooling, etc., fall into this category.
Better heat transfer enhancement techniques in the form of liquid cooling and PCM have emerged as the most promising passive cooling technique. Indirect cooling, where liquid gets circulated inside the channel, is one of the emerging techniques used to cool high-performance electronic modules. The liquid cold plates are also highly employed for electronic cooling and are deployed in varied applications like renewable energy systems, traction systems, medical equipment, IGBT, semi-conductor systems, lasers, data centres, industrial power applications, defence systems, avionics, fuel cells, battery cooling, and also for the high heat dissipation applications. Phase change materials (PCMs) are used as the most promising passive cooling technique and are light, easy to use, and have wide ranges of latent heat and melting point value.
There is a wide scope for the authors to contribute their high quality research findings towards the performance analysis on heat transfer enhancement techniques. The theme is related to experimental, numerical, and analytical methodology with or without an add on of optimization tools.
Heat transfer enhancement techniques are ideally employed to improve the thermal performance of the engineering systems. This is achieved either by reducing the thermal resistance or by increasing the effective heat transfer surface area. The majority of the heat transfer enhancement techniques are divided into active and passive cooling methods. Passive cooling methods like natural convection air cooling, thermoelectric cooling, heat pipes, and phase change-based cooling do not need any external energy for heat removal from the components. However, active cooling offers high cooling capacity and requires external energy in terms of a fan or blower for heat removal. Forced convection air cooling, liquid cooling, spray cooling, jet impingement cooling, refrigeration cooling, etc., fall into this category.
Better heat transfer enhancement techniques in the form of liquid cooling and PCM have emerged as the most promising passive cooling technique. Indirect cooling, where liquid gets circulated inside the channel, is one of the emerging techniques used to cool high-performance electronic modules. The liquid cold plates are also highly employed for electronic cooling and are deployed in varied applications like renewable energy systems, traction systems, medical equipment, IGBT, semi-conductor systems, lasers, data centres, industrial power applications, defence systems, avionics, fuel cells, battery cooling, and also for the high heat dissipation applications. Phase change materials (PCMs) are used as the most promising passive cooling technique and are light, easy to use, and have wide ranges of latent heat and melting point value.
There is a wide scope for the authors to contribute their high quality research findings towards the performance analysis on heat transfer enhancement techniques. The theme is related to experimental, numerical, and analytical methodology with or without an add on of optimization tools.