AUTHOR=Tseng Sheng-Hsiang 

TITLE=CMOS MEMS Design and Fabrication Platform

JOURNAL=Frontiers in Mechanical Engineering

VOLUME=8

YEAR=2022

URL=https://www.frontiersin.org/journals/mechanical-engineering/articles/10.3389/fmech.2022.894484

DOI=10.3389/fmech.2022.894484

ISSN=2297-3079

ABSTRACT=<p>This article mainly describes the technology related to the CMOS MEMS process platform provided by the Taiwan Semiconductor Research Institute (TSRI), including the process flow, design verification, back-end dicing, and packaging of the CMOS MEMS integrated sensing single chip. The front-end CMOS processes can be a standard 0.35 or 0.18 µm CMOS process, or even a BCD high-voltage process. Some academic designs also utilize this platform for in-house post-CMOS process. Finally, the article also explains in detail the CMOS MEMS design flowchart and implementation method provided by TSRI.</p>