lei chen
University of Michigan–Dearborn
Dearborn, United States
Associate Editor
Computational Materials Science
University of Michigan–Dearborn
Dearborn, United States
Associate Editor
Computational Materials Science
Jiangsu University of Science and Technology
Zhenjiang, China
Associate Editor
Structural Materials
Southeast University
Nanjing, China
Associate Editor
Mechanics of Materials
Curtin University
Perth, Australia
Associate Editor
Structural Materials
Hubei Jiufengshan Laboratory
Wuhan, China
Associate Editor
Semiconducting Materials and Devices
Rogers Corporation
Rogers, United States
Associate Editor
Ceramics and Glass
University of Missouri
Columbia, United States
Associate Editor
Computational Materials Science
Arts et Metiers Institute of Technology
Paris, France
Associate Editor
Mechanics of Materials
Seoul National University
Seoul, Republic of Korea
Associate Editor
Smart Materials
Jeonbuk National University
Jeonju, Republic of Korea
Associate Editor
Semiconducting Materials and Devices
Clemson University
Clemson, United States
Associate Editor
Structural Materials
Inha University
Incheon, Republic of Korea
Associate Editor
Smart Materials
Missouri University of Science and Technology
Rolla, United States
Associate Editor
Energy Materials
Gianluca Cicala
Catania, Italy
Associate Editor
Polymeric and Composite Materials
Superconducting and Other Innovative Materials and Devices Institute, Department of Physical Sciences and Technologies of Matter, National Research Council (CNR)
Genova, Italy
Associate Editor
Quantum Materials
University of Naples Parthenope
Naples, Italy
Associate Editor
Mechanics of Materials