94% of researchers rate our articles as excellent or good
Learn more about the work of our research integrity team to safeguard the quality of each article we publish.
Find out more
MINI REVIEW article
Front. Mater.
Sec. Polymeric and Composite Materials
Volume 12 - 2025 | doi: 10.3389/fmats.2025.1582990
This article is part of the Research TopicAdvanced Electronic Packaging Materials: Constitutive Model, Simulation, Design and ReliabilityView all 6 articles
Research Progress in Interface Optimization and Preparation Technology of High Thermal Conductivity Diamond/Copper Composite Materials
Provisionally accepted- 1Xi'an Modern Control Technology Research Institute, Xian China, Xian, China
- 2School of Materials and Chemical Engineering, Xi’an Technological University, Xian China, Xi'an, China
Select one of your emails
You have multiple emails registered with Frontiers:
Notify me on publication
Please enter your email address:
If you already have an account, please login
You don't have a Frontiers account ? You can register here
With the miniaturization and integration of microelectronic components, the demand for highthermal-conductivity electronic packaging materials has grown substantially. Diamond/copper (Dia/Cu) composites have become a focus of research due to their ultra-high thermal conductivity and low coefficient of thermal expansion. However, poor interfacial bonding and high interfacial thermal resistance between diamond and copper limit their practical performance. This paper reviews strategies to enhance interfacial bonding, including diamond surface metallization (e.g., electroless plating, magnetron sputtering, molten salt method, vacuum electroplating, and embedding) and copper matrix alloying (e.g., gas atomization and alloy smelting), and evaluates their effects on thermal transport properties. Additionally, the influence of preparation processessuch as vacuum hot-pressing sintering, high-temperature high-pressure sintering, spark plasma sintering, and melt infiltration on the microstructure and thermal conductivity of composites are discussed. Key factors including diamond surface roughness, particle size, volume fraction, and sintering conditions (e.g., temperature, pressure, and dwell time) are analyzed. Experimental and computational studies demonstrate that systematic optimization of these factors enhances the thermal conductivity of Dia/Cu composites, providing critical insights for developing nextgeneration high-performance electronic packaging materials.
Keywords: High thermal conductivity, Diamond/copper, Composite material, Surface metallization, Matrix alloying
Received: 25 Feb 2025; Accepted: 19 Mar 2025.
Copyright: © 2025 Xue, Li, Deng, Zhang, Chen, Ma and Wen. This is an open-access article distributed under the terms of the Creative Commons Attribution License (CC BY). The use, distribution or reproduction in other forums is permitted, provided the original author(s) or licensor are credited and that the original publication in this journal is cited, in accordance with accepted academic practice. No use, distribution or reproduction is permitted which does not comply with these terms.
* Correspondence: Aijie Ma, School of Materials and Chemical Engineering, Xi’an Technological University, Xian China, Xi'an, China
Disclaimer: All claims expressed in this article are solely those of the authors and do not necessarily represent those of their affiliated organizations, or those of the publisher, the editors and the reviewers. Any product that may be evaluated in this article or claim that may be made by its manufacturer is not guaranteed or endorsed by the publisher.