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ORIGINAL RESEARCH article

Front. Mater.
Sec. Mechanics of Materials
Volume 11 - 2024 | doi: 10.3389/fmats.2024.1452773
This article is part of the Research Topic Advanced Materials and Reliability in Electronic Packaging View all articles

Size dependence on shear fatigue and fracture behavior of ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under current stressing

Provisionally accepted
Bo Wang Bo Wang 1Wangyun Li Wangyun Li 1,2*Kailin Pan Kailin Pan 1*Wei Huang Wei Huang 1*Yubing Gong Yubing Gong 1*
  • 1 School of Mechanical and Electrical Engineering, Guangxi Key Laboratory of Manufacturing System and Advanced Manufacturing Technology, Guilin University of Electronic Technology, Guilin, China
  • 2 Flexible 3D System Integration Laboratory, Osaka University, Osaka, Japan

The final, formatted version of the article will be published soon.

    The shear fatigue performance and fracture behavior of microscale ball grid array (BGA) structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints with different heights (500 μm, 300 μm, and 100 μm) with increasing current density (from 6000 to 11000 A/cm2) were investigated systematically. The results reveal that the fatigue life of solder joints decreases with increasing current density, while increasing with decreasing the height of solder joints. The location of fatigue fracture shifts from solder matrix to the interface between solder and intermetallic compound (IMC) layer for those with heights of 500 μm and 300 μm with increasing current density, in which the interfacial fracture is triggered by current crowding at the groove of the IMC layer and driven by mismatch strain at the solder/IMC layer interface; while, the fatigue fracture all occurs in the solder matrix for solder joints with a height of 100 μm. Moreover, the fracture in solder matrix of solder joints with heights of 500 μm and 300 μm exhibits an arc-shape fracture path, while a linear path for those with a height of 100 μm. These fracture paths are consistent with the concentration distribution region of plastic strain energy in solder joints.

    Keywords: Shear fatigue, BGA solder joints, height, Current stressing, Fracture

    Received: 21 Jun 2024; Accepted: 23 Aug 2024.

    Copyright: © 2024 Wang, Li, Pan, Huang and Gong. This is an open-access article distributed under the terms of the Creative Commons Attribution License (CC BY). The use, distribution or reproduction in other forums is permitted, provided the original author(s) or licensor are credited and that the original publication in this journal is cited, in accordance with accepted academic practice. No use, distribution or reproduction is permitted which does not comply with these terms.

    * Correspondence:
    Wangyun Li, School of Mechanical and Electrical Engineering, Guangxi Key Laboratory of Manufacturing System and Advanced Manufacturing Technology, Guilin University of Electronic Technology, Guilin, China
    Kailin Pan, School of Mechanical and Electrical Engineering, Guangxi Key Laboratory of Manufacturing System and Advanced Manufacturing Technology, Guilin University of Electronic Technology, Guilin, China
    Wei Huang, School of Mechanical and Electrical Engineering, Guangxi Key Laboratory of Manufacturing System and Advanced Manufacturing Technology, Guilin University of Electronic Technology, Guilin, China
    Yubing Gong, School of Mechanical and Electrical Engineering, Guangxi Key Laboratory of Manufacturing System and Advanced Manufacturing Technology, Guilin University of Electronic Technology, Guilin, China

    Disclaimer: All claims expressed in this article are solely those of the authors and do not necessarily represent those of their affiliated organizations, or those of the publisher, the editors and the reviewers. Any product that may be evaluated in this article or claim that may be made by its manufacturer is not guaranteed or endorsed by the publisher.