AUTHOR=Zhang Liang , Zhong Su-Juan TITLE=Effect of Ni3Sn4 on the Thermo-Mechanical Fatigue Life of Solder Joints in 3D IC JOURNAL=Frontiers in Materials VOLUME=8 YEAR=2021 URL=https://www.frontiersin.org/journals/materials/articles/10.3389/fmats.2021.645782 DOI=10.3389/fmats.2021.645782 ISSN=2296-8016 ABSTRACT=

In this article, the 3D integration with Ni/Sn/Ni joints was conducted using transient liquid phase (TLP) bonding (250°C, 0.2 N) with different bonding time. After TLP bonding, plane-type Ni3Sn4 intermetallic compound (IMC) was observed, and when the bonding time is 180 min, complete Ni3Sn4 was found. The diffusion coefficient D was determined to be 32.4 μm2/min. Based on the finite element (FE) simulation, the results demonstrated that the shear stress and equivalent creep strain increased obviously with an increase in the IMC thickness; the results calculated show that the IMC thickness impacts the fatigue life of solder joints significantly, and the fatigue life decreases notably with an increase in the Ni3Sn4 thickness.