AUTHOR=Zhang Liang , Zhong Su-Juan 

TITLE=Effect of Ni3Sn4 on the Thermo-Mechanical Fatigue Life of Solder Joints in 3D IC

JOURNAL=Frontiers in Materials

VOLUME=8

YEAR=2021

URL=https://www.frontiersin.org/journals/materials/articles/10.3389/fmats.2021.645782

DOI=10.3389/fmats.2021.645782

ISSN=2296-8016

ABSTRACT=<p>In this article, the 3D integration with Ni/Sn/Ni joints was conducted using transient liquid phase (TLP) bonding (250°C, 0.2 N) with different bonding time. After TLP bonding, plane-type Ni<sub>3</sub>Sn<sub>4</sub> intermetallic compound (IMC) was observed, and when the bonding time is 180 min, complete Ni<sub>3</sub>Sn<sub>4</sub> was found. The diffusion coefficient <italic>D</italic> was determined to be 32.4 μm<sup>2</sup>/min. Based on the finite element (FE) simulation, the results demonstrated that the shear stress and equivalent creep strain increased obviously with an increase in the IMC thickness; the results calculated show that the IMC thickness impacts the fatigue life of solder joints significantly, and the fatigue life decreases notably with an increase in the Ni<sub>3</sub>Sn<sub>4</sub> thickness.</p>