AUTHOR=Praful Pallavi , Bailey Chris 

TITLE=Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies

JOURNAL=Frontiers in Electronics

VOLUME=5

YEAR=2025

URL=https://www.frontiersin.org/journals/electronics/articles/10.3389/felec.2024.1515860

DOI=10.3389/felec.2024.1515860

ISSN=2673-5857