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CORRECTION article

Front. Bioeng. Biotechnol.
Sec. Biosensors and Biomolecular Electronics
Volume 13 - 2025 | doi: 10.3389/fbioe.2025.1560319

Corrigendum: Recent advances of additively manufactured noninvasive kinematic biosensors

Provisionally accepted
Jeonghoon Lee Jeonghoon Lee 1Sangmin Park Sangmin Park 2Jaehoon Lee Jaehoon Lee 2Namjung Kim Namjung Kim 2*Min Ku Kim Min Ku Kim 3*
  • 1 Department of Mechanical Convergence Engineering, Hanyang University, Seoul, Republic of Korea
  • 2 Department of Mechanical Engineering, Gachon University, Seongnam, Gyeonggi, Republic of Korea
  • 3 School of Mechanical Engineering, Hanyang University, Seoul, Republic of Korea

This article is a correction to:

  1. Recent advances of additively manufactured noninvasive kinematic biosensors

    1. Read original article

The final, formatted version of the article will be published soon.

    Corrigendum on: Recent advances of additively manufactured noninvasive kinematic biosensors by Lee J, Park S, Lee J, Kim N and Kim MK (2023). Front. Bioeng. Biotechnol. 11:1303004. doi: 10.3389/fbioe.2023.1303004Incorrect Funding In the published article, there was an error in the Funding statement. The funder Hanyang University (HY-202100000003082) was not included. The correct Funding statement appears below.FUNDINGThe author(s) declare financial support was received for the research, authorship, and/or publication of this article. This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MSIT) (No. 2022R1C1C1008122, and No. 2022R1C1C1009387), and this work was supported by the research fund of Hanyang University (HY-202100000003082).The authors apologize for this error and state that this does not change the scientific conclusions of the article in any way. The original article has been updated.

    Keywords: noninvasive biosensors, Additive manufacturing, 3D printing, kinematic sensors, Low-cost fabrication

    Received: 14 Jan 2025; Accepted: 15 Jan 2025.

    Copyright: © 2025 Lee, Park, Lee, Kim and Kim. This is an open-access article distributed under the terms of the Creative Commons Attribution License (CC BY). The use, distribution or reproduction in other forums is permitted, provided the original author(s) or licensor are credited and that the original publication in this journal is cited, in accordance with accepted academic practice. No use, distribution or reproduction is permitted which does not comply with these terms.

    * Correspondence:
    Namjung Kim, Department of Mechanical Engineering, Gachon University, Seongnam, Gyeonggi, Republic of Korea
    Min Ku Kim, School of Mechanical Engineering, Hanyang University, Seoul, Republic of Korea

    Disclaimer: All claims expressed in this article are solely those of the authors and do not necessarily represent those of their affiliated organizations, or those of the publisher, the editors and the reviewers. Any product that may be evaluated in this article or claim that may be made by its manufacturer is not guaranteed or endorsed by the publisher.