Cong Gao
Chuandeng Hu
Jun Mei4*
Bo Hou
Zhanhang Du
Weijia Wen
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- 1Advanced Materials Thrust, Function Hub, Hong Kong University of Science and Technology (Guangzhou), Guangzhou, China
- 2HKUST Shenzhen-Hong Kong Collaborative Innovation Research Institute, Shenzhen, China
- 3Shenzhen Fantwave Tech. Co., Ltd., Shenzhen, China
- 4School of Physics, South China University of Technology, Guangzhou, China
- 5School of Physical Science and Technology and Collaborative Innovation Center of Suzhou Nano Science and Technology, Soochow University, Suzhou, China
- 6Department of Physics, Hong Kong University of Science and Technology, Hong Kong, China
A Corrigendum on
Barrier-free duct muffler for low-frequency sound absorption
by Cong Gao, Chuandeng Hu, Jun Mei, Bo Hou, Xianli Zhang, Zhanhang Du and Weijia Wen (2022). Front. Mater. 9:991959. doi: 10.3389/fmats.2022.991959
In the original article, there was an error regarding the Affiliation for “Xianli Zhang.” As well as having Affiliation [3], it should be
“Department of Physics, Hong Kong University of Science and Technology, Hong Kong, China.”
The authors apologize for this error and state that this does not change the scientific conclusions of the article in any way. The original article has been updated.
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All claims expressed in this article are solely those of the authors and do not necessarily represent those of their affiliated organizations, or those of the publisher, the editors and the reviewers. Any product that may be evaluated in this article, or claim that may be made by its manufacturer, is not guaranteed or endorsed by the publisher.
Keywords: helmholtz resonator, duct muffler, ventilation duct, sound absorption, porous material
Citation: Gao C, Hu C, Mei J, Hou B, Zhang X, Du Z and Wen W (2022) Corrigendum: Barrier-free duct muffler for low-frequency sound absorption. Front. Mater. 9:1062941. doi: 10.3389/fmats.2022.1062941
Received: 06 October 2022; Accepted: 14 October 2022;
Published: 08 November 2022.
Approved by:
Frontiers Editorial Office, Frontiers Media SA, SwitzerlandCopyright © 2022 Gao, Hu, Mei, Hou, Zhang, Du and Wen. This is an open-access article distributed under the terms of the Creative Commons Attribution License (CC BY). The use, distribution or reproduction in other forums is permitted, provided the original author(s) and the copyright owner(s) are credited and that the original publication in this journal is cited, in accordance with accepted academic practice. No use, distribution or reproduction is permitted which does not comply with these terms.
*Correspondence: Chuandeng Hu, Ym9zb25AZmFudHdhdmUuY29t; Jun Mei, cGhqdW5tZWlAc2N1dC5lZHUuY24=; Weijia Wen, cGh3ZW5AdXN0Lmhr